SUPERMICRO 1U PASSIVE CPU HEATSINK LGA 3647
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SUPERMICRO 1U PASSIVE CPU HEATSINK LGA 3647
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Type / Purpose
Processor
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Fan diameter
0cm
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Description
Specifications
This CPU heat sink is designed for Supermicro X11 generation general 1U servers equipped with Intel® Xeon® scalable processors. The heat sink has been fully tested and validated by Supermicro to ensure the best quality and cooling performance.
Prestanda |
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Lämplig för | Processor |
Modell | Kylfläns |
fläktdiameter | No |
Stödd processor uttag | LGA 3647 (Socket P) |
Kompatibla processorer | Intel® Xeon® |
Design |
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Rackkapacitet | 1U |
Strömtillförsel |
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Värmeavledningseffekt (TDP) | 205 W |
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